WebI'm not quite sure hy Austin discussed flip chip vs wire bond, since both the FB am FF packages utilize flip chip technolog. The main difference between the two package types are cost with the FB, bare die, version produced with the heat spreader top and with fewer package layers to save cost. Theses difference need to be considered in your ... WebFully Buffered DIMM (or FB-DIMM) is a memory technology that can be used to increase reliability and density of memory systems. Unlike the parallel bus architecture of …
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